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Model BD0922J75100AHF

Rev. A

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be

used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet

published specifications.

All of the Xinger components are constructed from organic PTFE based composites which possess excellent

electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and

ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.

An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the

transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying

pick and place equipment tolerances.

No Bias Footprint

6x .41

6x .33

.04

4x .25

.66

3x Transmission

lines

Plated thru holes to ground

Plated thru

holes to

ground

Circuit Pattern

Footprint Pad (s)

Solder Resist

Mounting Footprint

Dimensions are in Millimeters

DC Bias Footprint

6x .36

6x .33

.04

4x .25

.66

3x Transmission

lines

Plated thru

holes to

Circuit Pattern

Footprint Pad (s)

Solder Resist

0402

Capacitor

Mounting Footprint

Dimensions are in Millimeters

Plated thru

holes to

ground