TPS2373-3RGWT datasheet(2/42 Pages) TI1

No. de pieza	TPS2373-3RGWT

Descripción Electrónicos	High-Power PoE PD Interface with Advanced Startup

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Fabricante Electrónico	TI1 [Texas Instruments]

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TPS2373

SLUSCD1 – APRIL 2017

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Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

7

Detailed Description .............................................. 9

7.1

Overview ................................................................... 9

7.2

Functional Block Diagram ....................................... 10

7.3

Feature Description................................................. 10

7.4

Device Functional Modes........................................ 15

8

Application and Implementation ........................ 26

8.1

Application Information............................................ 26

8.2

Typical Application .................................................. 26

9

Power Supply Recommendations ...................... 31

10

Layout................................................................... 31

10.1

Layout Guidelines ................................................. 31

10.2

Layout Example .................................................... 31

10.3

EMI Containment .................................................. 32

10.4

Thermal Considerations and OTSD...................... 32

10.5

ESD....................................................................... 32

11

Device and Documentation Support ................. 33

11.1

Documentation Support ........................................ 33

11.2

Receiving Notification of Documentation Updates 33

11.3

Community Resources.......................................... 33

11.4

Trademarks ........................................................... 33

11.5

Electrostatic Discharge Caution ............................ 33

11.6

Glossary ................................................................ 33

12

Mechanical, Packaging, and Orderable

Information ........................................................... 33

12.1

Package Option Addendum .................................. 34

4 Revision History

DATE

REVISION

NOTES

April 2017

*

Initial release.

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