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AMC1301 Datasheet(PDF) 6 Page - Texas Instruments |
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AMC1301 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 34 page 6 AMC1301-Q1 SBAS792A – APRIL 2017 – REVISED APRIL 2017 www.ti.com Product Folder Links: AMC1301-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 6.7 Safety-Related Certifications VDE UL Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12, DIN EN 60950-1 (VDE 0805 Teil 1): 2014-08, and DIN EN 60065 (VDE 0860): 2005-11 Recognized under 1577 component recognition and CSA component acceptance NO 5 programs Reinforced insulation Single protection Certificate number: 40040142 File number: E181974 (1) Input, output, or the sum of input and output power must not exceed this value. 6.8 Safety Limiting Values Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A failure of the I/O may allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IS Safety input, output, or supply current θJA = 110.1°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C 206 mA θJA = 110.1°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C 315 PS Safety input, output, or total power θJA = 110.1°C/W, TJ = 150°C, TA = 25°C 1135(1) mW TS Maximum safety temperature 150 °C (1) Steady-state voltage supported by the device in case of a system failure. See specified common-mode input voltage VCM for normal operation. Observe analog input voltage range as specified in Absolute Maximum Ratings. The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. 6.9 Electrical Characteristics Minimum and maximum specifications apply from TA = –40°C to +125°C, VDD1 = 3.0 V to 5.5 V, VDD2 = 3.0 V to 5.5 V, VINP = –250 mV to +250 mV, and VINN = 0 V. Typical specifications are at TA = 25°C, VDD1 = 5 V, and VDD2 = 3.3 V (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUT VClipping Differential input voltage before clipping output VINP – VINN ±302.7 mV VFSR Specified linear differential full-scale VINP – VINN –250 250 mV VCM Specified common-mode input voltage (VINP + VINN) / 2 to GND1 –0.16 VDD1 – 2.1 V Absolute common-mode input voltage(1) (VINN + VINP) / 2 to GND1 –2 VDD1 V VCMov Common-mode overvoltage detection level VDD1 – 2 V VOS Input offset voltage Initial, at TA = 25°C, VINP = VINN = GND1 –200 ±50 200 µV TCVOS Input offset drift –3 ±1 3 µV/°C CMRR Common-mode rejection ratio fIN = 0 Hz, VCM min ≤ VCM ≤ VCM max –93 dB fIN = 10 kHz, VCM min ≤ VCM ≤ VCM max –93 CIND Differential input capacitance 1 pF RIN Single-ended input resistance VINN = GND1 18 k Ω RIND Differential input resistance 22 k Ω IIB Input bias current VINP = VINN = GND1 –82 –60 –48 µA TCIIB Input bias current drift 1 nA/°C BWIN Input bandwidth 1000 kHz |
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