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## 0002 Datasheet(Hoja de datos) 3 Page - M.S. Kennedy Corporation

 No. de Pieza. 0002 Descripción HIGH SPEED, BUFFER AMPLIFIER AMP Descarga 5 Pages Scroll/Zoom 100% Fabricante MSK [M.S. Kennedy Corporation] Página de inicio http://www.mskennedy.com Logo

 3 page APPLICATION NOTESHEAT SINKINGTo determine if a heat sink is necessary for your applicationand if so, what type, refer to the thermal model and governingequation below.RΘSA = ((TJ - TA)/PD) - (RΘJC) - (RΘCS)= ((125°C - 80°C) / 0.36W) - 40°C/W - 0.15°C/W= 125 - 40.15= 84.9°C/WThis heat sink in this example must have a thermal resistanceof no more than 84.9°C/W to maintain a junction temperatureof no more than +125°C.TJ=PD X (RΘJC +RΘCS +RΘSA) +TAWhereTJ=Junction TemperaturePD=Total Power DissipationRΘJC=Junction to Case Thermal ResistanceRΘCS=Heat Sink to Ambient Thermal ResistanceTC=Case TemperatureTA=Ambient TemperatureTS=Sink TemperatureThermal Model:Rev. - 10/003Governing Equation:Example:This example demonstrates a worst case analysis for the bufferoutput stage. This occurs when the output voltage is 1/2 thepower supply voltage. Under this condition, maximum powertransfer occurs and the output is under maximum stress.Conditions:VCC= ±12VDCVo= ±6Vp Sine Wave, Freq. = 1KHzRL= 100ΩFor a worst case analysis we will treat the ±6Vp sine wave asan 6 VDC output voltage.1.) Find Driver Power DissipationPD= (Vcc-Vo) (Vo/RL)= (12V-6V) (6V/100Ω)= 360mW2.) For conservative design, set TJ=+125°C Max.3.) For this example, worst case TA=+80°C4.) RΘJC = 40° C/W from MSK 0002H Data Sheet5.) RΘCS = 0.15° C/W for most thermal greases6.) Rearrange governing equation to solve for RΘSATypical Applications: