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LMG3410 Datasheet(PDF) 4 Page - Texas Instruments |
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LMG3410 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 29 page 4 LMG3410 SNOSD10B – APRIL 2016 – REVISED MARCH 2017 www.ti.com Product Folder Links: LMG3410 Submit Documentation Feedback Copyright © 2016–2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT V DS Drain-Source Voltage 600 V V DD Supply Voltage –0.3 20 V I DS Drain-Source Current, Pulsed –32 32 A V IN IN, LPM Pin Voltage 5.5 V T STG Storage Temperature –55 150 °C T J Operating Temperature –40 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±1000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±250 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDS Drain-Source Voltage 480 V VDD Supply Voltage 9.5 12 18 V IDS DC Drain-Source Current 12 A I+5V LDO External Load Current 5 mA TJ Operating Temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. (3) The Theta_JA specification is based on a JEDEC 2s2p PCB using thermal vias in still air. 6.4 Thermal Information THERMAL METRIC (1) (2) LMG3410 UNIT RWH (QFN) 32 PINS R θJA Junction-to-ambient thermal resistance(3) 26.5 °C/W R θJC(top) Junction-to-case (top) thermal resistance 5.3 °C/W R θJC(bot) Junction-to-case (bottom) thermal resistance 0.5 °C/W |
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