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LMG3410 Datasheet(PDF) 4 Page - Texas Instruments

No. de pieza LMG3410
Descripción Electrónicos  600-V 12-A Single Channel GaN Power Stage
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

LMG3410 Datasheet(HTML) 4 Page - Texas Instruments

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LMG3410
SNOSD10B – APRIL 2016 – REVISED MARCH 2017
www.ti.com
Product Folder Links: LMG3410
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
V DS
Drain-Source Voltage
600
V
V DD
Supply Voltage
–0.3
20
V
I DS
Drain-Source Current, Pulsed
–32
32
A
V IN
IN, LPM Pin Voltage
5.5
V
T STG
Storage Temperature
–55
150
°C
T J
Operating Temperature
–40
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±1000
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
±250
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDS
Drain-Source Voltage
480
V
VDD
Supply Voltage
9.5
12
18
V
IDS
DC Drain-Source Current
12
A
I+5V
LDO External Load Current
5
mA
TJ
Operating Temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
(3)
The Theta_JA specification is based on a JEDEC 2s2p PCB using thermal vias in still air.
6.4 Thermal Information
THERMAL METRIC (1) (2)
LMG3410
UNIT
RWH (QFN)
32 PINS
R θJA
Junction-to-ambient thermal resistance(3)
26.5
°C/W
R θJC(top)
Junction-to-case (top) thermal resistance
5.3
°C/W
R θJC(bot)
Junction-to-case (bottom) thermal resistance
0.5
°C/W


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