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CDCM61001 Datasheet(PDF) 3 Page - Texas Instruments

No. de pieza CDCM61001
Descripción Electrónicos  One Output, Integrated VCO, Low-Jitter Clock Generator
Download  35 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

CDCM61001 Datasheet(HTML) 3 Page - Texas Instruments

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CDCM61001
www.ti.com
SCAS869F
– FEBRUARY 2009 – REVISED JUNE 2011
AVAILABLE OPTIONS(1)
TA
PACKAGED DEVICES
FEATURES(2)
CDCM61001RHBT
32-pin QFN (RHB) package, small tape and reel
–40°C to +85°C
CDCM61001RHBR
32-pin QFN (RHB) package, tape and reel
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at ti.com.
(2)
These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content
can be accessed at www.ti.com/leadfree. GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package
materials that do not contain halogens, including bromine (Br), or antimony (Sb) above 0.1%of total product weight. N/A: Not yet
available Lead (Pb)-Free; for estimated conversion dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean
RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and, if designed to be soldered,
suitable for use in specified lead-free soldering processes.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
VALUE
UNIT
VCC_OUT, VCC_PLL1, VCC_PLL2,
Supply voltage range(2)
–0.5 to +4.6
V
VCC_VCO, VCC_IN
VIN
Input voltage range(3)
–0.5 to (VCC_IN + 0.5)
V
VOUT
Output voltage range(3)
–0.5 to (VCC_OUT + 0.5)
V
IIN
Input current
20
mA
IOUT
Output current
50
mA
TSTG
Storage temperature range
–65 to +150
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
condition is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All supply voltages must be supplied simultaneously.
(3)
Input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
MIN
NOM
MAX
UNIT
VCC_OUT
Output supply voltage
3.0
3.30
3.60
V
VCC_PLL1
PLL supply voltage
3.0
3.30
3.60
V
VCC_PLL2
PLL supply voltage
3.0
3.30
3.60
V
VCC_VCO
On-chip VCO supply voltage
3.0
3.30
3.60
V
VCC_IN
Input supply voltage
3.0
3.30
3.60
V
TA
Ambient temperature
–40
+85
°C
DISSIPATION RATINGS
(1) (2)
VALUE
TEST
4
× 4 VIAS
PARAMETER
CONDITIONS
ON PAD
UNIT
θJA
Thermal resistance, junction-to-ambient
0 LFM
35
°C/W
θJP
(3)
Thermal resistance, junction-to-pad
4
°C/W
(1)
The package thermal resistance is calculated in accordance with JESD 51 and JEDEC 2S2P (high-K board).
(2)
Connected to GND with nine thermal vias (0.3-mm diameter).
(3)
θJP (junction-to-pad) is used for the QFN package, because the primary heat flow is from the junction to the GND pad of the QFN
package.
Copyright
© 2009–2011, Texas Instruments Incorporated
3


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