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LM22670QMRE-ADJ/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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LM22670QMRE-ADJ/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
4 / 32 page LM22670, LM22670-Q1 SNVS584P – SEPTEMBER 2008 – REVISED NOVEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT VIN to GND 43 EN Pin Voltage –0.5 6 RT/SYNC Pin Voltage –0.5 7 V SW to GND(3) –5 VIN BOOT Pin Voltage VSW + 7 FB Pin Voltage –0.5 7 Power Dissipation Internally Limited Junction Temperature 150 °C For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549). (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) The absolute maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 50 ns. 6.2 Handling Ratings: LM22670 MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all V(ESD) Electrostatic discharge –2 2 kV pins(1) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Handling Ratings: LM22670-Q1 MIN MAX UNIT Tstg Storage temperature range –65 150 °C V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) –2 2 kV (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Supply Voltage 4.5 42 V Junction Temperature Range –40 125 °C 6.5 Thermal Information LM22670, LM22670-Q1 THERMAL METRIC(1)(2)(3) UNIT DDA NDR 8 PINS 7 PINS RθJA Junction-to-ambient thermal resistance 60 22 °C/W (1) For more information about traditional and new thermal metrics, see the application report IC Package Thermal Metrics (SPRA953). (2) The value of RθJA for the PFM package of 22°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 20 to 30 °C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 TO-263 THIN Package (SNVA328) for more information. (3) The value of RθJA for the SO Power PAD-8 exposed pad package of 60°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer. 4 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: LM22670 LM22670-Q1 |
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