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LM22670QMRE-ADJ/NOPB Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza LM22670QMRE-ADJ/NOPB
Descripción Electrónicos  42-V, 3-A SIMPLE SWITCHER, Step-Down Voltage Regulator With Features
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

LM22670QMRE-ADJ/NOPB Datasheet(HTML) 4 Page - Texas Instruments

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LM22670, LM22670-Q1
SNVS584P – SEPTEMBER 2008 – REVISED NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
MIN
MAX
UNIT
VIN to GND
43
EN Pin Voltage
–0.5
6
RT/SYNC Pin Voltage
–0.5
7
V
SW to GND(3)
–5
VIN
BOOT Pin Voltage
VSW + 7
FB Pin Voltage
–0.5
7
Power Dissipation
Internally Limited
Junction Temperature
150
°C
For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549).
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
The absolute maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a
pulse of up to 50 ns.
6.2 Handling Ratings: LM22670
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
V(ESD)
Electrostatic discharge
–2
2
kV
pins(1)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Handling Ratings: LM22670-Q1
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
V(ESD)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002(1)
–2
2
kV
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN
Supply Voltage
4.5
42
V
Junction Temperature Range
–40
125
°C
6.5 Thermal Information
LM22670, LM22670-Q1
THERMAL METRIC(1)(2)(3)
UNIT
DDA
NDR
8 PINS
7 PINS
RθJA
Junction-to-ambient thermal resistance
60
22
°C/W
(1)
For more information about traditional and new thermal metrics, see the application report IC Package Thermal Metrics (SPRA953).
(2)
The value of RθJA for the PFM package of 22°C/W is valid if package is mounted to 1 square inch of copper. The RθJA value can range
from 20 to 30 °C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 TO-263 THIN
Package (SNVA328) for more information.
(3)
The value of RθJA for the SO Power PAD-8 exposed pad package of 60°C/W is valid if package is mounted to 1 square inch of copper.
The RθJA value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer.
4
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Product Folder Links: LM22670 LM22670-Q1


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