4

LM2595

SNVS122C – MAY 1999 – REVISED MAY 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Maximum supply voltage

45

V

ON/OFF pin input voltage

–0.3

25

V

Feedback pin voltage

–0.3

25

V

Output voltage to ground (steady-state)

–1

V

Power dissipation

Internally limited

Lead temperature

KTT package

Vapor phase (60 sec)

215

°C

Infrared (10 sec)

245

NDH package (soldering, 10 sec)

260

Maximum junction temperature

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

4.5

40

V

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The package thermal impedance is calculated in accordance to JESD 51-7.

(3)

Thermal resistances were simulated on a 4-layer, JEDEC board

7.4 Thermal Information

LM2595

UNIT

KTT

(TO-263)

NDH

(TO-220)

5 PINS

5 PINS

Junction-to-ambient

—

50

°C/W

50

—

30

—

20

—

Junction-to-case (top) thermal resistance

2

2

°C/W