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STPSC8H065C Datasheet(PDF) 5 Page - STMicroelectronics |
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STPSC8H065C Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 8 page DocID024808 Rev 2 5/8 STPSC8H065C Package information 8 2 Package information Epoxy meets UL94, V0 Cooling method: conduction (C) Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at:www.st.com. ECOPACK® is an ST trademark. Figure 9. TO-220AB dimension definitions A F D1 J1 H1 ∅P Q D L1 L b E e1 e L20 L30 b1 c Resin gate 0.5 mm max. protrusion(1) Resin gate 0.5 mm max. protrusion(1) (1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites |
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