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TPS54618 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS54618 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 42 page TPS54618-Q1 SLVSBY9D – AUGUST 2013 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT PWRGD, VIN –0.3 7 EN, RT/CLK –0.3 4 Input voltage V COMP, SS, VSENSE –0.3 3 BOOT VPH+ 7 BOOT-PH 7 Output voltage PH –0.6 7 V PH (10-ns transient) –2 10 Source current EN, RT/CLK 100 µA COMP, SS 100 µA Sink current PWRGD 10 mA Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per AEC Q100-011 ±750 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VVIN Input voltage 3 6 V TA Operating ambient temperature –40 125 °C 6.4 Thermal Information TPS54618-Q1 THERMAL METRIC(1)(2) RTE (WQFN) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 44.38 °C/W RθJC(top) Junction-to-case (top) thermal resistance 46.09 °C/W RθJB Junction-to-board thermal resistance 15.96 °C/W ψJT Junction-to-top characterization parameter 0.69 °C/W ψJB Junction-to-board characterization parameter 15.91 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 4.55 °C/W (1) Unless otherwise specified, metrics listed in this table refer to JEDEC high-K board measurements (2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated Product Folder Links: TPS54618-Q1 |
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