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TPS54618 Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza TPS54618
Descripción Electrónicos  2.95-V to 6-V Input, 6-A Output, 2-MHz, Synchronous Step-Down SWIFT Switcher
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPS54618 Datasheet(HTML) 4 Page - Texas Instruments

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TPS54618-Q1
SLVSBY9D – AUGUST 2013 – REVISED JANUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
PWRGD, VIN
–0.3
7
EN, RT/CLK
–0.3
4
Input voltage
V
COMP, SS, VSENSE
–0.3
3
BOOT
VPH+ 7
BOOT-PH
7
Output voltage
PH
–0.6
7
V
PH (10-ns transient)
–2
10
Source current
EN, RT/CLK
100
µA
COMP, SS
100
µA
Sink current
PWRGD
10
mA
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-011
±750
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VVIN
Input voltage
3
6
V
TA
Operating ambient temperature
–40
125
°C
6.4 Thermal Information
TPS54618-Q1
THERMAL METRIC(1)(2)
RTE (WQFN)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
44.38
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
46.09
°C/W
RθJB
Junction-to-board thermal resistance
15.96
°C/W
ψJT
Junction-to-top characterization parameter
0.69
°C/W
ψJB
Junction-to-board characterization parameter
15.91
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.55
°C/W
(1)
Unless otherwise specified, metrics listed in this table refer to JEDEC high-K board measurements
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: TPS54618-Q1


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