A1

D

C

B

A

1

2

3

4

A2

A3

A4

B1

B2

B3

B4

C1

C2

C3

C4

D1

D2

D3

D4

A4

D

C

B

A

4

3

2

1

A3

A2

B4

B3

B2

B1

C4

C3

C2

C1

D4

D3

D2

D1

A1

Top View/Footprint

Bump View

Die Size: 1.56mm x 1.56mm (+ 0.03mm)

Bump Size: 0.25mm

Bump Pitch: 0.4mm

TS3A225E

SCDS329A – AUGUST 2012 – REVISED MAY 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PACKAGE OPTION #1: YFF- WCSP

Table 1. TS3A225E Pin Mapping (Top View)

4

3

2

1

D

/MIC_PRESENT

TIP_SENSE

MICp

MICn

C

RING2

RING2_SENSE

B

SLEEVE

SLEEVE_SENSE

A

DET_TRIGGER

ADDR_SEL

SDA

SCL

(1)

To ensure proper operation at least 1 of the VDD balls and at least 1 of the GND balls must be pad-

connected.

2

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