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TPS2052BDRG4 Datasheet(PDF) 7 Page - Texas Instruments

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No. de pieza TPS2052BDRG4
Descripción Electrónicos  Current-Limited, Power-Distribution Switches
Download  59 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPS2052BDRG4 Datasheet(HTML) 7 Page - Texas Instruments

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TPS2041B, TPS2042B, TPS2043B, TPS2044B
TPS2051B, TPS2052B, TPS2053B, TPS2054B
www.ti.com
SLVS514M – JUNE 2010 – REVISED JUNE 2016
Product Folder Links: TPS2041B TPS2042B TPS2043B TPS2044B TPS2051B TPS2052B TPS2053B TPS2054B
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to GND.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VI(IN), VI(INx)
Input voltage (2)
–0.3
6
V
VO(OUT), VO(OUTx)
(2)
Output voltage
–0.3
6
V
VI(EN), VI(ENx), VI(EN),
VI(ENx)
Input voltage
–0.3
6
V
VI(/OC), VI(OCx)
Voltage range
–0.3
6
V
IO(OUT), IO(OUTx)
Continuous output current
Internally limited
Continuous total power dissipation
See Dissipation Ratings
TJ
Operating virtual junction temperature
–40
125
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
±500
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VI(IN), VI(INx)
Input voltage
2.7
5.5
V
VI(EN), VI(ENx), VI(EN),
VI(ENx)
Input voltage
0
5.5
V
IO(OUT), IO(OUTx)
Continuous output current
0
500
mA
TJ
Operating virtual junction temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
TPS2042xx and TPS2053xx
UNIT
D
(SOIC)
DBV
(SOT-23)
DGN
(HVSSOP)
DRB
(SON)
8 PINS
16 PINS
5 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
119.3
81.6
208.6
53.6
47.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
67.6
42.7
122.9
58.7
53
°C/W
RθJB
Junction-to-board thermal resistance
59.6
39.1
37.8
35.5
14.2
°C/W
ψJT
Junction-to-top characterization parameter
20.3
10.4
14.6
2.7
1.2
°C/W
ψJB
Junction-to-board characterization
parameter
59.1
38.8
36.9
35.3
14.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal
resistance
N/A
N/A
N/A
6.7
7.3
°C/W


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