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TSC2007IPWG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TSC2007IPWG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 41 page ABSOLUTE MAXIMUM RATINGS (1) TSC2007 SBAS405A – MARCH 2007 – REVISED MARCH 2009...................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TYPICAL TYPICAL NO MISSING INTEGRAL GAIN CODES SPECIFIED TRANSPORT LINEARITY ERROR RESOLUTION PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) (BITS) TYPE DESIGNATOR RANGE MARKING NUMBER QUANTITY TSC2007IPW Tube, 90 16-Pin, 5 x 6.4 PW –40°C to +85°C TSC2007 Tape and TSC2007IPWR TSSOP Reel, 2000 TSC2007I ±1.5 0.1 11 Small Tape 12-Pin, TSC2007IYZGT and Reel, 250 3 x 4 Matrix, YZG –40°C to +85°C TSC2007I 1.5 x 2 Tape and TSC2007IYZGR WCSP Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI website at www.ti.com. Over operating free-air temperature range (unless otherwise noted). PRAMETER TSC2007 UNIT Analog input X+, Y+, AUX to GND –0.4 to VDD + 0.1 V Voltage Analog input X–, Y– to GND –0.4 to VDD + 0.1 V Voltage range VDD/REF pin to GND –0.3 to +5 V Digital input voltage to GND –0.3 to VDD + 0.3 V Digital output voltage to GND –0.3 to VDD + 0.3 V Power dissipation (TJ Max - TA)/θJA TSSOP package 86 Thermal impedance, θ JA Low-K 113 °C/W WCSP package High-K 62 Operating free-air temperature range, TA –40 to +85 °C Storage temperature range, TSTG –65 to +150 °C Junction temperature, TJ Max +150 °C Vapor phase (60 sec) +215 °C Lead temperature Infrared (15 sec) +220 °C IEC contact discharge(2) X+, X–, Y+, Y– ±15 kV IEC air discharge(2) X+, X–, Y+, Y– ±25 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. (2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details. 2 Submit Documentation Feedback Copyright © 2007–2009, Texas Instruments Incorporated Product Folder Link(s): TSC2007 |
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