6

TPS543B20

SLUSCR1 – MAY 2017

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Recommended Operating Conditions (continued)

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

MAX

UNIT

Output

BP, RAMP

–0.3

7

V

PGD

–0.3

7

–40

125

°C

–55

125

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TPS543B20

UNIT

RVF (LQFN)

40 PINS

Junction-to-ambient thermal resistance

29.1

°C/W

Junction-to-case (top) thermal resistance

19.3

°C/W

Junction-to-board thermal resistance

4.2

°C/W

Junction-to-top characterization parameter

1.4

°C/W

Junction-to-board characterization parameter

4.2

°C/W

Junction-to-case (bottom) thermal resistance

1.2

°C/W

(1)

Specified by design. Not production tested.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

HS FET

4.1

mΩ

LS FET

1.9

mΩ

Power stage driver dead-time

from Low-side off to High-side

VDD

12

ns

Power stage driver dead-time

from High-side off to Low-side

VDDN

15

ns

INPUT SUPPLY and CURRENT

Power stage voltage

4.0

19

VDD supply voltage

4.0

22

VDD bias current

Switching)

4.3

mA

VDD standby current

4.3

mA

UNDER VOLTAGE LOCKOUT

VDD UVLO rising threshold

3.8

V

0.2

v

VIN UVLO rising threshold

3.2

V

VIN UVLO hysteresis

0.2

v

EN on threshold

1.45

1.6

1.75

V

EN hysteresis

270

300

330

mV

EN input leakage current

–1

0

1

µA