AD9643BCPZ-250 datasheet(11/36 Pages) AD

No. de pieza	AD9643BCPZ-250

Descripción Electrónicos	14-Bit, 170 MSPS/210 MSPS/250 MSPS, 1.8 V Dual Analog-to-Digital Converter (ADC)

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Data Sheet

AD9643

Rev. E | Page 11 of 36

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Electrical

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

SYNC to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.3 V

SCLK to AGND

−0.3 V to DRVDD + 0.3 V

SDIO to AGND

−0.3 V to DRVDD + 0.3 V

OEB to AGND

−0.3 V to DRVDD + 0.3 V

PDWN to AGND

−0.3 V to DRVDD + 0.3 V

OR+/OR− to AGND

−0.3 V to DRVDD + 0.3 V

D0−/D0+ Through D13−/D13+

to AGND

−0.3 V to DRVDD + 0.3 V

DCO+/DCO− to AGND

−0.3 V to DRVDD + 0.3 V

Environmental

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +125°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. This increases the reliability of the solder

joints, maximizing the thermal capability of the package.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4

Unit

64-Lead LFCSP

9 mm × 9 mm

(CP-64-4)

0

26.8

1.14

10.4

°C/W

1.0

21.6

°C/W

2.0

20.2

°C/W

1

Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3

Per MIL-Std 883, Method 1012.1.

4

Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown in Table 7, airflow increases heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

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