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TC1300 Datasheet(PDF) 4 Page - Microchip Technology

No. de pieza TC1300
Descripción Electrónicos  300 mA CMOS LDO with Shutdown, Bypass and Independent Delayed Reset Function
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC1300 Datasheet(HTML) 4 Page - Microchip Technology

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TC1300
DS21385C-page 4
 2002 Microchip Technology Inc.
RESET Output
Voltage Range
VDET
1.0
1.2
6.0
6.0
VTA = 0°C to +70°C
TA = – 40°C to +125°C
Reset Threshold
VTH
2.59
2.63
2.66
V
TC1300R-XX, TA = +25°C
2.55
2.70
TC1300R-XX,
TA = – 40°C to +125°C
2.36
2.40
2.43
TC1300Y-XX, TA = +25°C
2.32
2.47
TC1300Y-XX,
TA = – 40°C to +125°C
Reset Threshold Tempco
∆VTH / ∆T
30
ppm/°C
VDET to Reset Delay
tRPD
—160
µsec
VDET = VTH to (VTH – 100 mV)
Reset Active Timeout Period
tRPU
140
300
560
msec
RESET Output Voltage Low
VOL
——0.3
V
VDET = VTH min,
ISINK = 1.2 mA
RESET Output Voltage High
VOH
0.8 VDET
——
V
VDET > VTH max,
ISOURCE = 500 µA
ELECTRICAL CHARACTERISTICS (CONTINUED)
VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 µF, SHDN > VIH, TA = 25°C, unless otherwise noted. BOLDFACE type specifications apply
for junction temperature (Note 8) of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note 1: VR is the regulator output voltage setting.
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value
measured at a 1V differential.
5: Thermal Regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for t = 10 msec.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissi-
pation causes the device to initiate thermal shutdown. Please see Section 4.0, “Thermal Considerations”, of this data
sheet for more details.
7: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ (VR + VDROPOUT).
8: The junction temperature of the device is approximated by soaking the device under test at an ambient temperature
equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature
over the ambient temperature is not significant.
TCVOUT
VOUTMAX VOUTMIN
() 10
6
×
VOUT
T
×
--------------------------------------------------------------------------------------
=


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