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Qxx25R6 Datasheet(PDF) 6 Page - Littelfuse

No. de pieza Qxx25R6
Descripción Electrónicos  RoHS compliant
Download  11 Pages
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Fabricante Electrónico  LITTELFUSE [Littelfuse]
Página de inicio  http://www.littelfuse.com
Logo LITTELFUSE - Littelfuse

Qxx25R6 Datasheet(HTML) 6 Page - Littelfuse

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© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/30/16
Teccor® brand Thyristors
25 Amp Standard & Alternistor (High Commutation) Triacs
Soldering Parameters
Reflow Condition
Pb – Free assembly
Pre Heat
-Temperature Min (T
s(min))
150°C
-Temperature Max (T
s(max))
200°C
-Time (min to max) (t
s)
60 – 180 secs
Average ramp up rate (LiquidusTemp)
(T
L) to peak
5°C/second max
T
S(max) to TL - Ramp-up Rate
5°C/second max
Reflow
-Temperature (T
L) (Liquidus)
217°C
-Temperature (t
L)
60 – 150 seconds
PeakTemperature (T
P)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (t
p)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peakTemperature (T
P)
8 minutes Max.
Do not exceed
280°C
Physical Specifications
Environmental Specifications
Test
Specifications and Conditions
High Temperature
Voltage Blocking
MIL-STD-750: Method 1040, Condition A
Rated V
RRM, 125°C, 1008 hours
Temperature Cycling
MIL-STD-750: Method 1051
-40°C to 125°C, 15-minute dwell,
100 cycles
Biased Temp &
Humidity
EIA/JEDEC: JESD22-A101
320VDC, 85°C, 85%RH, 1008 hours
High Temp. Storage
MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage
-40°C, 1008 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability
ANSI/J-STD-002, Category 3, Test A
Lead Bend
MIL-STD-750: Method 2036, Condition E
Terminal Finish
100% Matte Tin-plated
Body Material
UL recognized epoxy meeting flammability
classification 94V-0
Lead Material
Copper Alloy
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Time
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
Preheat
Ramp-up
Ramp-up
Ramp-down
Ramp-do


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