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DM505LRBABFR Datasheet(PDF) 8 Page - Texas Instruments |
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DM505LRBABFR Datasheet(HTML) 8 Page - Texas Instruments |
8 / 290 page A C E G J L N R U W AA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 B D F H K M P T V Y AB SPRS916_BALL_01 8 DM505 SPRS976D – NOVEMBER 2016 – REVISED JULY 2017 www.ti.com Submit Documentation Feedback Terminal Configuration and Functions Copyright © 2016–2017, Texas Instruments Incorporated 4 Terminal Configuration and Functions 4.1 Pin Diagram Figure 4-1 shows the ball locations for the 367 plastic ball grid array (PBGA) package and are used in conjunction with Table 4-1 through Table 4-27 to locate signal names and ball grid numbers. Figure 4-1. ABF S-PBGA-N367 Package (Bottom View) NOTE The following bottom balls are not connected: C4 / C7 / C9 / C11 / C13 / C15 / C19 / D4 / D5 / D9 / D11 / D13 / D17 / D18 / D19 / D20 / E4 / E5 / E6 / E9 / E11 / E13 / E15 / E18 / E19 / F5 / F9 / F11 / F18 / G13 / G15 / G17 / G20 / H3 / H4 / H5 / H6 / J8 / J9 / J12 / J13 / J14 / J18 / J19 / J20 / K3 / K4 / K5 / K6 / L9 / L10 / L11 / L13 / L14 / L17 / L18 / L19 / L20 / M3 / M4 / M5 / M6 / N9 / N11 / N13 / N14 / N17 / N18 / N19 / N20 / P3 / P4 / P5 / P6 / R8 / R10 / R11 / R13 / R14 / R15 / R17 / R18 / R19 / R20 / T3 / T6 / U5 / U10 / U12 / U14 / U18 / V4 / V5 / V6 / V8 / V10 / V12 / V14 / V17 / V18 / V19 / W3 / W4 / W5 / W10 / W12 / W14 / W18 / W19 / W20 / Y4 / Y7 / Y10 / Y12 / Y14 / Y16 / Y19. These balls do not exist on the package. 4.2 Pin Attributes Table 4-1 describes the terminal characteristics and the signals multiplexed on each ball. The following list describes the table column headers: 1. BALL NUMBER: Ball number(s) on the bottom side associated with each signal on the bottom. 2. BALL NAME: Mechanical name from package device (name is taken from muxmode 0). 3. SIGNAL NAME: Names of signals multiplexed on each ball (also notice that the name of the ball is the signal name in muxmode 0). NOTE Table 4-1 does not take into account the subsystem multiplexing signals. Subsystem multiplexing signals are described in Section 4.3, Signal Descriptions. NOTE In the Driver off mode, the buffer is configured in high-impedance. |
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