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TMP303EDRLT Datasheet(PDF) 4 Page - Texas Instruments

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No. de Pieza. TMP303EDRLT
Descripción  Easy-To-Use, Low-Power, Low-Supply Temperature Range Monitor In Micropackage
Descarga  22 Pages
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Fabricante  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TMP303EDRLT Datasheet(HTML) 4 Page - Texas Instruments

 
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TMP303
SBOS486G – JULY 2009 – REVISED JULY 2017
www.ti.com
Product Folder Links: TMP303
Submit Documentation Feedback
Copyright © 2009–2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply Voltage, VS – GND
3.6
V
Input Pins, Voltage
SOH, HYSTSET1, HYSTSET0
–0.5
VS +0.5
V
Output Pin, Voltage
OUT
–0.5
VS +0.5
V
Output Pin, Current
OUT
–55
8
mA
Operating Temperature
130
°C
Junction Temperature, TJ max
150
°C
Storage Temperature, Tstg
–60
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1000
Machine model (MM)
±200
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VS
Power Supply Voltage
1.4
3.6
V
TA
Specified Temperature Range
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
TMP303
UNIT
DRL (SOT-563)
6 PINS
RθJA
Junction-to-ambient thermal resistance
168
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
2.4
°C/W
RθJB
Junction-to-board thermal resistance
42.3
°C/W
ψJT
Junction-to-top characterization parameter
0.9
°C/W
ψJB
Junction-to-board characterization parameter
42.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W


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