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TPS75105YFFR Datasheet(PDF) 4 Page - Texas Instruments |
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TPS75105YFFR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page 4 TPS75100, TPS75103, TPS75105 SBVS080J – SEPTEMBER 2006 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: TPS75100 TPS75103 TPS75105 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN range –0.3 7 V VISET, VENA, VENB, VDX range –0.3 VIN V IDX for D1A, D2A, D1B, D2B 35 mA D1A, D2A, D1B, D2B short-circuit duration Indefinite Continuous total power dissipation Internally limited Junction temperature, TJ –55 150 °C Storage temperature, Tstg –55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 6.3 Recommended Operating Conditions PARAMETER MIN NOM MAX UNIT VIN Input voltage 2.7 5.5 V IDX Operating current per LED 3 25 mA tPWM On-time for PWM signal 33 µs TJ Operating junction temperature range –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TPS7510x UNIT YFF (DSBGA) DSK (WSON) 9 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 101.6 65.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 1.2 54.0 °C/W RθJB Junction-to-board thermal resistance 17.6 39.5 °C/W ψJT Junction-to-top characterization parameter 0.6 1.6 °C/W ψJB Junction-to-board characterization parameter 17.8 39.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 23.6 °C/W |
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