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CSL0901YT Datasheet(PDF) 6 Page - Rohm |
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CSL0901YT Datasheet(HTML) 6 Page - Rohm |
6 / 8 page www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. Data Sheet Direction for Circuit Board Warping 0.8mm 0.85m m 0.8m m 0.8m m CSL0901 Series 6/6 2016.03 - Rev.B 4-5. Soldering Pattern for Recommendation We recommend the soldering pattern that shows on the right. It will be different according to mounting situation of circuit board, therefore, please concern before designing. ※ The product has adopted the electrode structure that it should solder with back electrode of the product. Thus, please be informed that the shape of electrode pin of solder fillet formation is not guaranteed. 4-6. Reflow Profile For reflow profile, please refer to the conditions below:(※) ・ Meaning of marks, Conditions Mark Meanings Conditions Tsmax Maximum of pre-heating temperature 180ºC Tsmin Minimum of pre-heating temperature 140ºC ts Time from Tsmin to Tsmax Over 60sec. TL Reference temperature 230 to 260ºC tL Retention time for TL Within 40sec. TP Peak temperature 260ºC(Max) tP Time for peak temperature Within 10sec. Δ TR/Δt Temperature rising rate Under 3ºC/sec. Δ TD/Δt Temperature decreasing rate Over -3ºC/sec. ※ Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary by customer’s own conditions. 4-7. Cleaning after Soldering Please follow the conditions below if the cleaning is necessary after soldering. Solvent We recommend to use alcohols solvent such as, isopropyl alcohols Temperature Under 30ºC within 3 minutes Ultrasonic Cleaning 15W/Below 1 liter (capacity of tank) Drying Under 100ºC within 3 minutes |
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