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CSP20S60S-A Datasheet(PDF) 1 Page - Chip Integration Technology Corporation

No. de pieza CSP20S60S-A
Descripción Electrónicos  20A Surface Mount Low Barrier Diode
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Fabricante Electrónico  CITC [Chip Integration Technology Corporation]
Página de inicio  http://www.citcorp.com.tw/english/index.php
Logo CITC - Chip Integration Technology Corporation

CSP20S60S-A Datasheet(HTML) 1 Page - Chip Integration Technology Corporation

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1
Dimensions in inches and (millimeters)
■ Features
Mechanical data
■ Maximum ratings and electrical characteristics
O
Rating at 25 C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
■ Outline
Low forward voltage drop.
Excellent high temperature stability.
Fast switching capability.
Suffix "G" indicates Halogen-free part, ex.CSP20S60SG-A.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
I
O
I
F S M
R
θ J A
T , T
J
S T G
Forward rectified current
Forward surge current
Thermal resistance
Operating and Storage temperature
Parameter
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Conditions
Symbol
CSP20S60S-A
UNIT
-65 ~ +150
20
320
A
A
O C/W
O C
31
R
θ J A
Junction to ambient(2)
O C/W
Junction to ambient(1)
73
Forward voltage drop
Reverse current
Parameter
Marking code
CSP20S60S
DC blocking voltage
Working peak reverse voltage
Peak repetitive reverse voltage
V
R M
V
RW M
V
R R M
60
V
TO-277
V
R ( R M S )
RMS reverse voltage
42
V
Reverse breakdown voltage
0.216 (5.48)
0.208 (5.28)
0.264 (6.70)
0.248 (6.30)
0.028 (0.71)
0.016 (0.41)
0.028 (0.71)
0.016 (0.41)
0.073 (1.85)
0.069 (1.75)
0.145 (3.69)
0.133 (3.39)
0.069 (1.74)
0.057 (1.44)
0.037 (0.95)
0.033 (0.85)
0.037 (0.95)
0.033 (0.85)
0.124 (3.15)
0.112 (2.85)
0.049 (1.25)
0.037 (0.95)
0.014 (0.35)
0.010 (0.25)
PIN 2
1
3
2
• Epoxy : UL94-V0 rated flame retardant.
.
• Case : Molded plastic, TO-277
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
.
• Polarity: Indicated by cathode band
.
• Mounting Position : Any
.
• Weight : Approximated 0.093 grams
0.077 (1.96)
0.069 (1.76)
PIN 1
PIN 3
Note : 1.FR-4 PCB, 2oz.Copper.
2.Polymide PCB, 2oz.Copper.Cathode pad dimensions 18.8mm x 14.4mm.Anode pad dimensions 5.6mm x 14.4mm.
20A Surface Mount Low Barrier Diode
CSP20S60S-A
V
F
I
R
O
V
= V
T = 25 C
R
R R M
J
O
V
= V
T = 125 C
R
R R M
J
Conditions
Symbol
TYP.
UNIT
0.5
mV
mA
MIN.
MAX.
O
I = 20A, T = 25 C
F
J
530
100
I = 0.5mA
R
V
( B R ) R
60
V
470
0.26
Document ID : DS-12KEF
Revised Date : 2014/11/03
Revision : C2


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