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AD9239 Datasheet(PDF) 9 Page - Analog Devices

No. de pieza AD9239
Descripción Electrónicos  Serial Output 1.8 V ADC
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD9239 Datasheet(HTML) 9 Page - Analog Devices

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AD9239
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to DRGND
−0.3 V to +2.0 V
AGND to DRGND
−0.3 V to +0.3 V
AVDD to DRVDD
−2.0 V to +2.0 V
DOUT ± x to DRGND
−0.3 V to DRVDD + 0.3 V
SDO, SDI/SDIO, CLK± , VIN ± x,
VCMx, TEMPOUT, RBIAS to AGND
−0.3 V to AVDD + 0.3 V
SCLK, CSB, PGMx, RESET,
PDWN to AGND
−0.3 V to AVDD + 0.3 V
Environmental
Storage Temperature Range
−65°C to +125°C
Operating Temperature Range
−40°C to +85°C
Lead Temperature
(Soldering 10 sec)
300°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints, maximizing
the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
72-Lead LFCSP (CP-72-3)
16.2
7.9
0.6
°C/W
Typical θJA, θJB, and θJC values are specified for a 4-layer board in
still air. Airflow increases heat dissipation, effectively reducing
θJA. In addition, metal in direct contact with the package leads
from metal traces and through holes, ground, and power planes
reduces the θJA.
ESD CAUTION
Rev. E | Page 8 of 40


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