4

TPS23521

SLVSDX2 – SEPTEMBER 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input Voltages

–0.3

20

V

–0.3

6.5

V

–0.3

20

V

–0.3

30

V

–0.3

30

V

–40

125

°C

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

0

5.5

V

0

18

V

0

0.1

V

1

200

nF

1

10

kΩ

120

2,000

kΩ

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TPS23525

UNIT

PW (TSSOP)

16 PINS

Junction-to-ambient thermal resistance

98.4

°C/W

Junction-to-case (top) thermal resistance

31.3

°C/W

Junction-to-board thermal resistance

44.3

°C/W

Junction-to-top characterization parameter

1.8

°C/W

Junction-to-board characterization parameter

43.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W