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TPS23521 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS23521 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 29 page 4 TPS23521 SLVSDX2 – SEPTEMBER 2017 www.ti.com Product Folder Links: TPS23521 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input Voltages VVCC (current into VCC <10 mA) –0.3 20 V VSNS, VOV, VTMR, VPROG –0.3 6.5 V VGATE, VGATE2 –0.3 20 V VUVEN –0.3 30 V VD, VSS –0.3 30 V Operating Junction Temperature, TJ –40 125 °C Storage temperature, Tstg –55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) 500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VOV, VTMR, VPROG, Vref/PG 0 5.5 V VD, VUVEN 0 18 V VSNS 0 0.1 V CSS 1 200 nF RSS 1 10 kΩ RD 120 2,000 kΩ (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TPS23525 UNIT PW (TSSOP) 16 PINS RθJA Junction-to-ambient thermal resistance 98.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 31.3 °C/W RθJB Junction-to-board thermal resistance 44.3 °C/W ψJT Junction-to-top characterization parameter 1.8 °C/W ψJB Junction-to-board characterization parameter 43.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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