FDD9409L datasheet(2/8 Pages) ONSEMI

No. de pieza	FDD9409L

Descripción Electrónicos	N-Channel Logic Level PowerTrench MOSFET

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Publication Order Number:

FDD9409L_F085/D

Semiconductor Components Industries, LLC, 2016

December, 2016, Rev. 1.0

FDD9409L_F085

N-Channel Logic Level PowerTrench® MOSFET

40 V, 90 A, 2.6 m



Features

 Typical RDS(on) = 2.1 m at VGS = 10V, ID = 80 A

 Typical Qg(tot) = 52 nC at VGS = 10V, ID = 80 A

 UIS Capability

 RoHS Compliant

 Qualified to AEC Q101

Applications

 Automotive Engine Control

 PowerTrain Management

 Solenoid and Motor Drivers

 Electronic Steering

 Integrated Starter/Alternator

 Distributed Power Architectures and VRM

 Primary Switch for 12V Systems

MOSFET Maximum Ratings TJ = 25°C unless otherwise noted.

Symbol

Parameter

Ratings

Units

VDSS

Drain-to-Source Voltage

40

V

VGS

Gate-to-Source Voltage

±20

V

ID

Drain Current - Continuous (VGS=10) (Note 1)

TC = 25°C

90

A

Pulsed Drain Current

TC = 25°C

See Figure 4

EAS

Single Pulse Avalanche Energy

(Note 2)

33.7

mJ

PD

Power Dissipation

150

W

Derate Above 25oC1

W/oC

TJ, TSTG Operating and Storage Temperature

-55 to + 175

oC

RJC

Thermal Resistance, Junction to Case

1

oC/W

RJA

Maximum Thermal Resistance, Junction to Ambient

(Note 3)

52

oC/W

Package Marking and Ordering Information

Device Marking

Device

Package

Reel Size

Tape Width

Quantity

FDD9409L

FDD9409L_F085

D-PAK(TO-252)

13”

16mm

2500units

Notes:

1: Current is limited by bondwire configuration.

2: Starting TJ = 25°C, L = 15uH, IAS = 67A, VDD = 40V during inductor charging and VDD = 0V during time in avalanche.

3: RJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder

mounting surface of the drain pins. RJC is guaranteed by design, while RJA is determined by the board design. The maximum rating

presented here is based on mounting on a 1 in2 pad of 2oz copper.

D

G

S

G

S

D

TO-252

D-PAK

(TO-252)

For current package drawing, please refer to the Fairchild web‐

site at http://www.fairchildsemi.com/package‐drawings/TO/

TO252A03.pdf.

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